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《麻省理工科技评论》 第129卷 第4期 · 2026年7月刊 · 中文解读

光刻巨头的挑战:ASML的高数值孔径EUV光刻机

Light work · Clive Thompson
约 48 分钟Front/Engineering在小程序里点播,20 到 60 分钟做好
这篇讲什么
本文介绍了ASML最新的高数值孔径EUV光刻机,该机器能够制造更小的芯片特征,以满足人工智能时代对更快芯片的需求,并探讨了其垄断地位及潜在竞争对手的挑战。
原文开头
The AI era needs ever faster chips. ASML has a monopoly on the expensive machines needed to make them. work ASML’s high-NA EUV machine Can anyone catch up? By Clive Thompson Optimized tin zapping ASML made its EUV light source brighter, in parallel with developing the high-NA machine. J os Benschop is climbing a ladder to get to the top of his newest machine. It’s a bit of a schlep. The contraption is the size of a double-decker bus—more than 150 tons of gleaming precision-milled aluminum covered in thousands of snaking tubes, colored cables, and pressurized tanks. From the ground, it looks like a futuristic V8 engine. …
摘自《麻省理工科技评论》(MIT Technology Review)第129卷 第4期 · 2026年7月刊,Clive Thompson。仅引用开头一小段供了解文章,版权归原刊所有,全文请阅读原刊。
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