从晶圆到纳米堆叠：Terafab如何挑战物理极限

Every chip begins on a polished silicon wafer. Its surface is coated, exposed to light, etched and covered with new materials dozens of times. Each pass adds another part of the processor: transistor channels, gates, insulation, power connections and the microscopic wires carrying data. Terafab plans to connect that manufacturing process directly with chip architecture, memory design, packaging and real-world testing. Instead of sending a design through several companies and waiting months for results, its engineers could print experimental wafers, inspect them, redesign the weakest structures and begin another run within the same production network. That loop becomes essential below the 0.7-nanometer class. …