超纳米域实现铜箔强度与导电性的协同提升

We introduce an impurity-engineering strategy (20, 21) to produce high-performance, 10-μm-thick Cu foils through direct current elec- trodeposition at industrial current densities. Beyond conventional NGs, the Cu foil contains super-nano domains with a characteristic size in the range of 1 to 10 nm formed by the localized incorporation of additive-derived organic elements into the Cu matrix. These do- mains are arranged in a periodic gradient throughout the foil thick- ness. This gradient super-nano domain (GSD) architecture imparts an exceptional combination of ultrahigh strength, enhanced ductility, high electrical conductivity, and thermal stability. …